A Photolithography Process Design for 5 nm Logic Process Flow

With the introduction of EUV lithography, the photolithographic process in 5 nm logic process can be simplified to use mostly single exposure method.In a typical 5 nm logic process, the contact-poly pitch (CPP) is 44-50 nm, the minimum metal pitch (MPP) is around 30-32 nm.And the overlay budget is estimated to be 2.5 nm (on product overlay).Althoug

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Fuzzy Logic-Based Operation of Battery Energy Storage Systems (BESSs) for Enhancing the Resiliency of Hybrid Microgrids

The resiliency of power systems can be enhanced during emergency situations by using microgrids, due to their capability to supply local loads.However, precise prediction of disturbance events is very difficult rather the occurrence probability can be expressed as, high, medium, or low, etc.Therefore, a fuzzy logic-based battery energy storage syst

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